Development of etch hillocks on different Si(hkl) planes in silicon anisotropic etchingZUBEL, I; KRAMKOWSKA, M.Surface science. 2008, Vol 602, Num 9, pp 1712-1721, issn 0039-6028, 10 p.Article

Anisotropic etching of silicon as a tool for creating injection molding tooling surfacesWERKMEISTER, Jaime; GOSALVEZ, Miguel A; WILLOUGHBY, Patrick et al.Journal of microelectromechanical systems. 2006, Vol 15, Num 6, pp 1671-1680, issn 1057-7157, 10 p.Article

Differences in etching characteristics of TMAH and KOH on preparing inverted pyramids for silicon solar cellsYUJIE FAN; PEIDE HAN; PENG LIANG et al.Applied surface science. 2013, Vol 264, pp 761-766, issn 0169-4332, 6 p.Article

Silicon template fabrication for imprint process with good demolding characteristicsKAWATA, Hiroaki; MATSUE, Masato; KUBO, Kensuke et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 700-704, issn 0167-9317, 5 p.Conference Paper

Difference in activated atomic steps on (111) silicon surface during KOH and TMAH etchingSATO, Kazuo; MASUDA, Takehiro; SHIKIDA, Mitsuhiro et al.Sensors and materials. 2003, Vol 15, Num 2, pp 93-99, issn 0914-4935, 7 p.Article

Fabrication of sub-20 nm nanostructures by combination of nano plastic forming and etching (NPFE)RASHIDI, Hassan; YOSHINO, Masahiko.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 9, issn 0960-1317, 095003.1-095003.10Article

Silicon microoptical mirrors to make close parallel beams with conventional laser diodesMORI, Tetsuji; SUGAWARA, Satoru; ADACHI, Kazuhiko et al.Journal of microelectromechanical systems. 2005, Vol 14, Num 1, pp 37-43, issn 1057-7157, 7 p.Article

Macroporous silicon-based deep anisotropic etchingTAO, Yi; ESASHI, Masayoshi.Journal of micromechanics and microengineering (Print). 2005, Vol 15, Num 4, pp 764-770, issn 0960-1317, 7 p.Article

Anisotropic etching of silicon in a two-component alkaline solutionVAZSONYI, E; VERTESY, Z; TOTH, A et al.Journal of micromechanics and microengineering (Print). 2003, Vol 13, Num 2, pp 165-169, issn 0960-1317, 5 p.Article

Fast prototyping of high-aspect ratio, high-resolution X-ray masks by gas-assisted focused ion beamKHAN MALEK, C; HARTLEY, F. T; NEOGI, J et al.Microsystem technologies. 2003, Vol 9, Num 6-7, pp 409-412, issn 0946-7076, 4 p.Article

Applications and simulation of unconventional bulk-micromachining using underetching of {100} silicon planesSCHRÖPFER, G; DE LABACHELERIE, M; TELLIER, C. R et al.Microsystem technologies. 1999, Vol 5, Num 4, pp 194-199, issn 0946-7076Article

Reflectivity of an etched silicon surface with pyramids: II. Experimental results from different etching conditionsCHEN JIAN WU; WEI, Pal-Jen; JEN FIN LIN et al.Journal of micromechanics and microengineering (Print). 2009, Vol 19, Num 12, issn 0960-1317, 125019.1-125019.6Article

A cellular automaton-based simulator for silicon anisotropic etching processes considering high index planesZHOU, Zai-Fa; HUANG, Qing-An; LI, Wei-Hua et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 4, issn 0960-1317, S38-S49Article

Formation and field emission property of single-crystalline Zn microtip arrays by anodizationKUAN, C. Y; CHOU, J. M; LEU, I. C et al.Electrochemistry communications. 2007, Vol 9, Num 8, pp 2093-2097, issn 1388-2481, 5 p.Article

Faster simulations of step bunching during anisotropic etching : formation of zigzag structures on Si(1 10)GOSALVEZ, M. A; XING, Y; HYNNINEN, T et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 4, issn 0960-1317, S27-S37Conference Paper

A novel process for perfect convex corner realization in bulk micromachiningPAL, Prem; CHANDRA, Sudhir.Journal of micromechanics and microengineering (Print). 2004, Vol 14, Num 10, pp 1416-1420, issn 0960-1317, 5 p.Article

Effect of magnesium in KOH solution on anisotropic wet etching of siliconTANAKA, Hiroshi; DI CHENG; INOUE, Kazuyuki et al.International symposium on micro-nano mechatronics and human science. 2004, pp 121-125, isbn 0-7803-8607-8, 1Vol, 5 p.Conference Paper

A phase-change type micropump with aluminum flap valvesWOO YOUNG SIM; HYEUN JOONG YOON; OK CHAN JEONG et al.Journal of micromechanics and microengineering (Print). 2003, Vol 13, Num 2, pp 286-294, issn 0960-1317, 9 p.Article

A model explaining mask-corner undercut phenomena in anisotropic silicon etching: a saddle point in the etching-rate diagramSHIKIDA, Mitsuhiro; NANBARA, Ken-Ichi; KOIZUMI, Tohru et al.Sensors and actuators. A, Physical. 2002, Vol 97-98, pp 758-763, issn 0924-4247, 6 p.Conference Paper

Study on convex-corner undercutting formed by masked-maskless etching in aqueous KOHXINXIN LI; RONGMING LIN; JIANMIN MIAO et al.Journal of micromechanics and microengineering (Print). 2000, Vol 10, Num 3, pp 309-313, issn 0960-1317Article

Surface morphology of anisotropically etched single-crystal siliconSHIKIDA, Mitsuhiro; TOKORO, Kenji; UCHIKAWA, Daisuke et al.Journal of micromechanics and microengineering (Print). 2000, Vol 10, Num 4, pp 522-527, issn 0960-1317Article

Exploring the activation energy during nanoscale structural evolution in wet etchingGOSALVEZ, M. A; SATO, K.International symposium on micro-nano mechatronics and human science. 2004, pp 127-132, isbn 0-7803-8607-8, 1Vol, 6 p.Conference Paper

Elastomer microspring arrays for biomedical sensors fabricated using micromachined silicon moldsVAN HOUT, Jacha I; SCHEURER, Jörg; CASEY, Vincent et al.Journal of micromechanics and microengineering (Print). 2003, Vol 13, Num 6, pp 885-891, issn 0960-1317, 7 p.Article

Advanced sacrificial poly-Si technology for fluidic systemsBERENSCHOT, J. W; TAS, N. R; LAMMERINK, T. S. J et al.Journal of micromechanics and microengineering (Print). 2002, Vol 12, Num 5, pp 621-624, issn 0960-1317Article

Influence of the angle between etched (near) Si{111} surfaces and the substrate orientation on the underetch rate during anisotropic wet-chemical etching of siliconNIJDAM, A. J; GARDENIERS, J. G. E; BERENSCHOT, J. W et al.Journal of micromechanics and microengineering (Print). 2001, Vol 11, Num 5, pp 499-503, issn 0960-1317Article